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ASUS網上商店價格. HK$169.00. HK$339.00. 節省 HK$170.00. 配件組包含:多功能手機殼、感應式手機架、便攜卡夾. 自由組裝,滿足各種使用需求. 展開感應式支架,手機隨即自動開啟指定應用程式. 便攜式卡夾,無須取出卡片即可使用. 立即購買.
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Intel® Z690 (LGA 1700) ATX motherboard with PCIe® 5.0, DDR5, three M.2 slots, 14+1 DrMOS, HDMI®, DisplayPort™, 2.5 Gb Ethernet, USB 3.2 Gen 2x2 Type-C®, front USB 3.2 Gen 1 Type-C®, Thunderbolt™ 4 support and Aura Sync RGB lighting. Intel ® LGA 1700 socket: Ready for 12 th gen Intel ® processors.
Intel® H610 (LGA 1700) mic-ATX motherboard with DDR4, PCIe 4.0, M.2 slot, Realtek 1 Gb Ethernet, HDMI®, D-Sub, USB 3.2 Gen 1 ports, SATA 6 Gbps, COM header, RGB header. Intel® LGA 1700 socket: Ready for 13 th & 12 th Gen Intel ® processors.
Intel® LGA 1700 Socket: Ready for 13 th and 12 th Gen Intel ® processors. Ultrafast Connectivity: PCIe 4.0, two M.2 slots, Realtek 2.5Gb Ethernet, Wi-Fi 6, rear USB 3.2 Gen 2, front USB 3.2 Gen 1 Type-C ®. Comprehensive Cooling: VRM heatsinks, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
PRIME B550-PLUS AC-HES caters to daily users and all builders looking for well-rounded specs and a range of options for performance tuning via intuitive software and firmware.
ASUS PRIME X670-P is an AMD X670 (Ryzen AM5) ATX motherboard with PCIe 5.0 storage support, three M.2 slots, DDR5, USB 3.2 Gen 2x2 Type-C®, front USB 3.2 Gen 1 Type-C®, BIOS FlashBack™, DisplayPort/HDMI, Thunderbolt™ 4 header,and 2.5Gb Ethernet.