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    • Pattern transferring device

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      圖片: researchgate.net

      • A mask or reticle (sometimes photomask and photoreticle) is a pattern transferring device used in the fabrication of microelectronic for pattern transfers.
      en.wikichip.org/wiki/mask
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  2. 2024年1月29日 · A mask or reticle (sometimes photomask and photoreticle) is a pattern transferring device used in the fabrication of microelectronic for pattern transfers. Contents. 1 Overview. 2 Terminology. 3 Manufacturing Process. 4 Reticle limit. 5 See also. Overview.

  3. 2022年12月13日 · Description. A photomask is basically a “master template” of an IC design. A mask comes in different sizes. A common size is 6- x 6-inch. A basic and simple mask consists of a quartz or glass substrate. The photomask is coated with an opaque film. More complex masks use other materials.

  4. en.wikipedia.org › wiki › PhotomaskPhotomask - Wikipedia

    A photomask (also simply called a mask) is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits (ICs or "chips") to produce a pattern on a thin wafer of material (usually silicon ).

  5. 2024年4月30日 · Mask making is a fabrication process where a computer-aided design (CAD) is transferred to a thin (80-100 nm) layer of metal in a glass or fused silica substrate, known as mask or photomask. The metal works as an absorption layer for light at different wavelengths.

  6. Mask fabrication is an established standard process available in the CMi CM-1 cleanroom. The process flow below describes process parameters, steps of operation and equipment used. The current process uses the Heidelberg Instruments VPG200 laser writer and the Hamatech HMR900 Mask Processor.

  7. Contact Masks Fabrication. This document is intended for users who wish to fabricate a photo mask through the NanoFab facility at the University of Science...

  8. Lithography is the process of transferring patterns of geometric shapes in a mask to a thin layer of radiation-sensitive material (called resist) covering the surface of a semiconductor wafer. Figure 5.1 illustrates schematically the lithographic process employed in IC fabrication.