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1. global.kyocera.com › prdct › fcElectrostatic Chucks (ESCs) | Fine Ceramics (Advanced ...

   global.kyocera.com › prdct › fc

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   An internal electrode is embedded to utilize the electrostatic force generated between this structure and the Si wafer placed on the ESC surface. This product is used for silicon wafer mounting, flatness correction and cooling the silicon wafer during the semiconductor manufacturing process.

2. cgmaterial.com › products › electrostatic-chuck-al2o3-aln-sapphireElectrostatic Chuck (Al2O3, AlN, Sapphire) – CG MATERIAL

   cgmaterial.com › products › electrostatic-chuck-al2o3-aln-sapphire

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   An electrostatic chuck (ESC) is a device used to hold a substrate in place during various processes, such as semiconductor manufacturing. The ESC is made of a ceramic material, such as alumina (Al2O3), aluminum nitride (AlN), or sapphire, and is designed to hold the substrate through electrostatic attraction.

3. 其他人也問了

   How does ESC work?

   • The ESC structure is integrated with back side gas (BSG) cooling to control the temperature of the wafer during processing. The cooling system introduces an inert gas with high thermal conductivity, such as helium, to the backside surface of the wafer.

   Characterization of Electrostatic Chuck (ESC) Performance with Changes

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   How does an ESC clamp work?

   • An ESC clamp works by applying voltage to a dielectric layer between the wafer and a conductive electrode, which resembles a parallel plate capacitor. The bipolar electrostatic force clamps the wafer (top electrode) against the dielectric layer (insulator) [1,2].

   Characterization of Electrostatic Chuck (ESC) Performance with Changes

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   What does leak-by flow mean in ESC/BSG systems?

   • In ESC/BSG systems, leak-by flow of the cooling gas (helium) is measured as a gauge for clamp performance: a high amount of BSG leak-by flow means that the wafer is not properly clamped, and therefore the cooling gas is not reaching the wafer. Conversely, a low amount of leak-by flow represents a well chucked wafer with high cooling efficiency.

   Characterization of Electrostatic Chuck (ESC) Performance with Changes

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   How does ESC/BSG work?

   • To characterize the performance of the ESC/BSG system, full thickness wafers (150 mm in diameter) are mechanically bonded to two types of carriers (“A” and “B”) using a 50 um thermally curing adhesive layer, thinned to a thickness of 100 um with a grind process, then baked. The stack bow of these post-baked samples ranges from 2 to 52 um.

   Characterization of Electrostatic Chuck (ESC) Performance with Changes

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   How does a bipolar ESC work?

   • The bipolar electrostatic force clamps the wafer (top electrode) against the dielectric layer (insulator) [1,2]. Figure 1 shows a schematic diagram of the bipolar ESC in which an insulator layer is positioned on the bottom electrode. Fig. 1.

   Characterization of Electrostatic Chuck (ESC) Performance with Changes

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4. www.shinko.co.jp › english › productCeramic Electrostatic Chuck | Services - SHINKO

   www.shinko.co.jp › english › product

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   • Introduction
   • Features
   • Applications

   SHINKO designs ceramic electrostatic chucks which are widely used for semiconductor wafer processing such as etching and CVD equipment. SHINKO offers high quality, low cost, short lead time and manufactures using consistent production processes such as firing and machining of ceramic, assembly and inspection. SHINKO's electrostatic chucks meets cus...

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   Material: Alumina ceramic (Coulomb force type and Johnsen-Rahbek effect type)

   Dimension: Max size φ300 mm

   Ceramic thickness: 0.8~10.0 mm

   Operation temperature: -20 ~ +200 °C

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   Semiconductor manufacturing equipment (Etching, Ashing, CVD, PVD)

   Wafer transfer tool

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5. www.electrogrip.com › egrip2023 › productsElectroadhesion Gripper | Electrostatic Chuck | ElectroGrip

   www.electrogrip.com › egrip2023 › products

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   They provide high uniformity, high durability, and ability to grip a variety of semiconductor substrates such as silicon, gallium arsenide, and insulating substrates such as sapphire (for use with InP, GaN, SiC), silicon carbide, quartz, glass (for

   • 位置: 6945 Lynn Way, Pittsburgh PA, 15208 USA
   • Email: mail@electrogrip.com

   • 電話: (412) 247-0993

6. zhuanlan.zhihu.com › p › 648878496晶圆静电吸附（ESC）详解 - 知乎簡

   zhuanlan.zhihu.com › p › 648878496

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   什么是ESC？ ESC，Electrostatic Chuck，即静电吸附。 当处理用于制造芯片的硅片和用于液晶面板的玻璃基板时，需要将它们吸附并固定在设备的真空室中。 此时，传统的用爪子固定的方法很可能会划伤晶圆，并且对特定部位施加强力可能会导致碎裂。 另外，如果采用真空吸附，则无法采用像吸盘那样减压吸附的方法。 因此，出现了利用静电的方法。 ESC的三种吸附原理. 静电吸盘吸引力一般涉及三种吸附原理（库仑力、约翰逊-拉贝克力，梯度力）但并不总是只有一种力在起作用，多种力结合起来产生一种吸引物体的力。 库仑力: 库仑力是电荷间的相互作用力，由库仑定律定义。 在静电吸附中，当电压施加到吸附电极上时，将在晶圆和吸附表面之间产生电荷。 这些电荷之间的相互吸引力就是库仑力。

7. valleydesign.com › electrostatic-chuck-refinishingElectrostatic Chuck (ESC) Surface Refinishing by Valley Design

   valleydesign.com › electrostatic-chuck-refinishing

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   Electrostatic Chuck (ESC or e-chuck) surface refinishing is available from Valley Design. Chucks can be made flat, concave or convex, and in any surface finish from lapped to polished.

8. csmantech.org › wp-content › acfrcwduploadsCharacterization of Electrostatic Chuck (ESC) Performance ...

   csmantech.org › wp-content › acfrcwduploads

   Electrostatic chucks (ESCs) are widely used to clamp semiconductor wafers during processing in various equipment such as dry etchers, vacuum based chemical-vapor deposition tools (CVD), and ion implantation tools [1-6].