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Hardware Engineering. John Ternus is Apple’s senior vice president of Hardware Engineering, reporting to CEO Tim Cook. John leads all hardware engineering, including the teams behind iPhone, iPad, Mac, AirPods, and more. John joined Apple’s Product Design team in 2001 and has been a vice president of Hardware Engineering since 2013.
Johny joined Apple in 2008 to lead development of the A4, the first Apple-designed system on a chip. Prior to Apple, Johny held senior positions at Intel and IBM in the area of processor development and design. He earned both a bachelor’s and master’s degree in Computer Science from Technion, Israel’s Institute of Technology. . 管理层 ...
Apple 网页页脚 1. 折抵换购服务由 Apple 的折抵服务合作伙伴提供。折抵金额报价仅为预估价，实际折抵金额可能低于预估价值，具体金额取决于设备的状况、配置、推出年份，以及发售国家或地区。并非所有设备均有资格获得折抵金额。
John Giannandrea is Apple’s senior vice president of Machine Learning and AI Strategy, reporting to CEO Tim Cook. John joined Apple in 2018 and oversees the strategy for artificial intelligence and machine learning across the company and development of Core ML and Siri technologies.
Craig Federighi is Apple’s senior vice president of Software Engineering, reporting to CEO Tim Cook. Craig oversees the development of iOS and macOS. His teams are responsible for delivering the software at the heart of Apple’s innovative products, including the user interface, applications and frameworks.
Chief Financial Officer. Luca Maestri is Apple’s senior vice president and chief financial officer reporting to CEO Tim Cook. As CFO, Luca oversees the accounting, business support, financial planning and analysis, treasury, real estate, investor relations, internal audit and tax functions at Apple.
亚光质感玻璃背板. 黑色钛金属、白色钛金属、 蓝色钛金属、原色钛金属. 钛金属设计. 超瓷晶面板. 亚光质感玻璃背板. 容量 1. 128GB. 256GB. 512GB. 1TB. 256GB. 512GB. 1TB. 尺寸和重量 2. 宽度： 70.6 毫米. (2.78 英寸) 高度： 146.6 毫米. (5.77 英寸) 厚度： 8.25 毫米. (0.32 英寸) 重量： 187 克 (6.60 盎司) 宽度： 76.7 毫米. (3.02 英寸) 高度： 159.9 毫米. (6.29 英寸)
