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Amkor Technology 是世界领先的半导体互连服务外包提供商。 凭借超过 50 年持续改进、成长和创新的经验，Amkor 已成为深受全球大多数领先半导体供应商信赖的合作伙伴。
Amkor Technology 很荣幸成为即将于太平洋标准时间 2021 年 11 月 17 日上午 10:00 - 中午 12:15 举办的 SEMI Arizona 虚拟论坛活动“ SILICON DESERT — 创新的绿洲 ”的赞助商。. 自 20 世纪 50 年代初以来，亚利桑那州一直是科技公司的沙漠绿洲，很多知名企业都在这里安家 ...
Amkor Technology 是世界领先的半导体互连服务外包提供商。 凭借超过 50 年持续改进、成长和创新的经验，Amkor 已成为深受全球大多数领先半导体供应商信赖的合作伙伴。
Amkor is advancing the evolution of 5G RF module design. Amkor DSMBGA enables integration of more components. The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026. Amkor continues to innovate in advanced SiP technologies.
Near-Term Targets: Amkor commits to reduce absolute scope 1 and 2 GHG emissions 55% by 2033 from a 2022 base year. Amkor also commits that 80% of its suppliers by emissions covering purchased goods and services and capital goods will have science-based targets by 2028.
TEMPE, Ariz. -- (BUSINESS WIRE)--Jul. 21, 2015-- Amkor Technology, Inc. (Nasdaq: AMKR) today announced plans to expand its state-of-the-art assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.
以堆叠技术实现快速部署. 堆叠 CSP 系列产品运用 Amkor 的行业领先的 ChipArray ® 球栅阵列 (CABGA) 制造能力。. 这项大规模、大批量制造能力让多种产品和多个厂房能够迅速部署最新的晶片堆叠技术，从而在最大程度上降低总成本。. 客户信赖 Amkor 能够帮助他们克服 ...
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